Forced convection compact N2 reflow device 'NRY-520S-5Z'
Lead-free small-sized mounting board compatible compact N2 reflow device
The "NRY-520S-5Z" is a reflow device designed for electronic device manufacturers, aimed at improving temperature accuracy (in-plane temperature distribution) and soldering under low oxygen concentration. It is suitable for reflowing high-density mounted substrates through an independent upper and lower hot air circulation method that combines forced convection with a rectifying plate. 【Features】 - Clean room compatible, compact design, and energy-saving features - Equipped with five heating zones despite its small size - Capable of setting various temperature profiles - Can also be used for reflowing to form solder balls for BGA and CSP - Peripheral devices including loaders/unloaders and intermediate buffers are also available, etc. *For more details, please download the PDF or contact us.
- Company：大和製作所
- Price：Other
